PCB Design
Layout That Works in Production
PCB layout is where circuit design becomes physical reality. A schematic that simulates perfectly can fail in the real world if the layout engineer doesn’t understand signal integrity, power distribution, thermal management, and manufacturability. Our PCB designers work in the same building as the electrical engineers who created the schematics and the technicians who’ll assemble the boards—which means fewer iterations and faster time to working prototypes.
What We Design
High-density layouts
Multi-layer boards with fine-pitch BGAs, 0201 passives, and high pin-count connectors. We route boards with thousands of nets while maintaining signal integrity and design-for-manufacturability.
High-speed digital
DDR memory interfaces, high-speed serial links (USB 3.0, PCIe, Gigabit Ethernet), and clock distribution networks requiring controlled impedance and length matching.
RF and microwave
50-ohm transmission lines, antenna feed networks, and RF circuit layouts from DC to 6 GHz. We account for ground plane strategy, via stitching, and component placement to minimize parasitics.
Rigid-flex circuits
Boards that combine rigid sections with flexible interconnects, commonly used in wearables, medical devices, and space-constrained products.
Power electronics
High-current traces, thermal management, and component placement for switch-mode power supplies and motor control circuits.
Tools and Capabilities
Cadence Allegro and Altium Designer used in-house, with support for Mentor Graphics, and other PCB CAD systems. Signal integrity analysis support for high-speed designs, along with access to thermal profiling and inspection equipment during assembly to validate prototypes.
PCB types
Single-sided, double-sided, and multi-layer boards (up to 20+ layers). Rigid, flexible, and rigid-flex designs. Surface mount, through-hole, and mixed technology. Controlled impedance for high-speed signals.
Design standards
Design for manufacturability (DFM) to ensure high yields in production. Design for testability (DFT) to enable efficient factory testing. Design for EMC to meet compliance requirements.
Our Design Process
Schematic capture and BOM generation
Working from electrical engineering schematics, we create production-ready BOMs with manufacturer part numbers and alternates.
Component placement
We collaborate with electrical and mechanical teams to place components for optimal signal flow, thermal performance, and mechanical fit within enclosures.
Routing and layer stackup
Careful routing with attention to signal integrity, power distribution, EMC compliance, and design-for-manufacturing rules. We specify layer stackups optimized for your circuit’s requirements and cost constraints.
Design rule checking
Automated DRC plus manual reviews to catch issues before boards are fabricated.
Board procurement
We maintain relationships with PCB fabricators and can source boards to meet your schedule and budget for prototype assembly.
In-House Prototyping
We assemble PCB prototypes in-house using a pick-and-place machine and a reflow oven. Our assembly equipment handles components as small as 01005s and BGAs with 0.3mm pitch. Our IPC-610 certified technicians also provide hand assembly for rework and prototype builds.
Having assembly in-house means our layout designers get immediate feedback on manufacturability issues. If a component is difficult to place or a thermal profile isn’t right, we know before we release designs to your contract manufacturer. This integrated approach allows us to maintain tighter control over quality, schedules, and overall execution.
Why PCB Layout Matters
Bad PCB layout kills good circuit design. Ground loops create noise. Poor thermal design causes components to overheat. Inadequate clearances fail voltage testing. Uncontrolled impedances corrupt high-speed signals. Missing test points make factory testing expensive.
We’ve laid out boards for products ranging from battery-powered IoT sensors to military radar systems. The difference between a layout that works in the lab and one that ships in volume is understanding what manufacturers need, what test engineers need, and what actually happens when your circuit moves from 25°C on the bench to 125°C in the field.